Single and multi-way thermal channel as a heat pipe is a device that can quickly transfer large amounts of heat with a small temperature difference between a hot source and a cold source and is used in most electronic industries today. In this article, the performance of single and multi-way thermal channels is presented with the aim of improving system cooling. For this purpose, modeling of the channels has been done first, and then the performance of single, two and three-way channels has been compared in different heat fluxes. The simulation results are consistent with the experimental results of the previous researches, with a maximum error of 3%, and it can be understood that the system is significantly improved by increasing the number of cooling channels.
